SyChip WLAN modules integrate industry leading 802.11a/b/g/n wireless LAN chipsets into the smallest form factors possible. Several substrate technologies are utilized to optimize cost and package volume. Substrate examples are LTCC, epoxy glass, and polysilicon IPD. Modules are often customized to include only the components required by the customer to minimize size and cost. Modules are delivered factory tested and ready to integrate, thus speeding time to market demands.
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